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| TS507 High Precision Rail-to-Rail Operational Amplifier PRELIMINARY DATA s s s s s s s s s Ultra low offset voltage: 60V max Rail-to rail input/output voltage swing Operating from 2.7V to 5.5V High-speed: 2.2MHz Low consumption: 0.85mA Supply voltage rejection ratio: 85dB ESD protection 2kV Latch-up immunity Available in SOT23-5 micropackage Pin Connections (top view) TS507ILT Output VDD Non Inverting Input 1 2 3 4 Inverting Input 5 VCC Description The TS507 is a high performance rail-to-rail output amplifier with very low offset voltage. This amplifier uses a new trimming technique that yields ultra low offset voltages without any need for external nulling. The circuit presents very stable electrical characteristics over the entire supply voltage range, and is particularly intended for professional and telecom applications. The TS507 is housed in the space-saving 5 pins SOT23 package that makes it well suited for battery-powered systems. This micropackage simplifies the PC board design because of it's ability to be placed in tight spaces (outside dimensions are: 2.8mm x 2.9mm) TS507ID-TS507IN-TS507IST N.C. Inverting Input Non Inverting Input VDD 1 2 3 4 _ + 8 7 6 5 N.C. VCC Output N.C. TS507IQT NC Inverting Input Non Inverting Input VDD 1 2 3 4 8 7 6 5 NC VCC Output NC Applications s s s Precision filters Transformer/line drivers Personal entertainments (CD players) s s Portable communication (cell phones, pagers) Instrumentation & sensoring Order Codes Part Number TS507IN TS507ID/TS507IDT TS507IST TS507ILT TS507IQT Temperature Range Package DIP DIP mini SO SOT23-5 DFN Packaging Tube Tube or Tape & Reel Tape & Reel Tape & Reel Tape & Reel Marking -40, +125C TBD November 2004 Revision 1 1/9 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. TS507 1 Absolute Maximum Ratings Absolute Maximum Ratings Table 1: Key parameters and their absolute maximum ratings Symbol VCC Vid Vin Toper Tstg Tj Supply voltage 1 Differential Input Voltage 2 Input Voltage Operating Free Air Temperature Range Storage Temperature Range Maximum Junction Temperature Thermal Resistance Junction to Case SOT23-5 SO8 DIP8 4 3 Parameter Value 6 5.5 Gnd to Vcc -40 to +125 -65 to +150 150 Unit V V V C C C/W Rthjc 81 28 80 256 2 260 C/W kV C Rthja ESD Thermal Resistance Junction to Ambient - SOT23-5 Human Body Model Lead Temperature (soldering, 10sec) 1) All voltage values, except differential voltage are with respect to network ground terminal. 2) Differential voltages are the non-inverting input terminal with respect to the inverting input t erminal. 3) The magnitude of input and output voltages must never exceed VCC +0.3V. 4) Short-circuits can cause excessive heating and destructive dissipation. Table 2: Operating Conditions Symbol VCC Vicm Supply voltage Common Mode Input Voltage Range Parameter Value 2.7 to 5.5 VDD -0.2 to VCC +0.1 Unit V V 2/9 Electrical Characteristics 2 Electrical Characteristics TS507 Table 3: VCC+ = +5V, V DD- = 0V, Tamb = 25C (unless otherwise specified) - Operational Amplifier Symbol Icc Iib Ri Supply Current Input Bias Current Tmin Top Tmax Input Resistance, f = 1kHz Input Offset Voltage Vio 0V VCM 3.5V Tmin Top Tmax 0V VCM 5V Tmin Top Tmax Parameter Min. Typ. 0.85 50 TBD 1 0 60 100 300 350 150 Max. Unit mA nA M V Vio Iio Input Offset Voltage Drift Tmin Top Tmax Input Offset Current Tmin Top Tmax Input Offset Current Drift Tmin Top Tmax Output Short Circuit Current Large Signal Voltage Gain RL = 2k 1V Vout 4V V/C 0.3 5 TBD TBD nA Iio Ios Avd GBP en 0.08 50 125 2.2 12 TDB nA ------C mA dB MHz Gain-bandwidth Product, f = 100kHz Equivalent Input Noise Voltage, f = 1kHz Rs = 1k Total Harmonic Distortion Av = 20dB Vo = 2Vpp Output Voltage Swing RL = 2k Large Signal Voltage Swing RL = 10k Slew Rate Unity Gain, RL = 2k Power Supply Rejection Ratio Common Mode Rejection Ratio Vic = 0V to 3.5V Vic = 0V to 5V f = 10kHz RL = 2k f = 1kHz TBD nV ----------Hz % THD Vopp Vopp SR PSRR CMRR V Vpp TBD V/s 0.65 100 125 94 dB dB 3/9 TS507 3 Package Mechanical Data Package Mechanical Data 3.1 DIP-8 Package Plastic DIP-8 MECHANICAL DATA mm. DIM. MIN. A a1 B B1 b b1 D E e e3 e4 F I L Z 0.44 3.3 1.6 0.017 8.8 2.54 7.62 7.62 7.1 4.8 0.130 0.063 0.38 0.7 1.39 0.91 0.5 0.5 9.8 0.346 0.100 0.300 0.300 0.280 0.189 0.015 1.65 1.04 TYP 3.3 0.028 0.055 0.036 0.020 0.020 0.386 0.065 0.041 MAX. MIN. TYP. 0.130 MAX. inch P001F 4/9 Package Mechanical Data 3.2 SO-8 Package SO-8 MECHANICAL DATA DIM. A A1 A2 B C D E e H h L k ddd 0.1 5.80 0.25 0.40 mm. MIN. 1.35 0.10 1.10 0.33 0.19 4.80 3.80 1.27 6.20 0.50 1.27 8 (max.) 0.04 0.228 0.010 0.016 TYP MAX. 1.75 0.25 1.65 0.51 0.25 5.00 4.00 MIN. 0.053 0.04 0.043 0.013 0.007 0.189 0.150 0.050 0.244 0.020 0.050 inch TYP. MAX. 0.069 0.010 0.065 0.020 0.010 0.197 0.157 TS507 5/9 TS507 3.3 Mini SO-8 Package Package Mechanical Data 6/9 Package Mechanical Data 3.4 SOT23-5 Package TS507 SOT23-5L MECHANICAL DATA mm. DIM. MIN. A A1 A2 b C D E E1 e e1 L 0.35 0.90 0.00 0.90 0.35 0.09 2.80 2.60 1.50 0 .95 1.9 0.55 13.7 TYP MAX. 1.45 0.15 1.30 0.50 0.20 3.00 3.00 1.75 MIN. 35.4 0.0 35.4 13.7 3.5 110.2 102.3 59.0 37.4 74.8 21.6 TYP. MAX. 57.1 5.9 51.2 19.7 7.8 118.1 118.1 68.8 mils 7/9 TS507 3.5 DFN8 Package Package Mechanical Data 8/9 Revision History 4 Revision History Date 01 Oct 2004 Revision 1 First Release Description of Changes TS507 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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